邦定热胶是什么胶？邦定冷胶又是什么胶水？有什么区别？

  COB邦定胶/IC封装胶是指裸露的集成电路芯片(IC Chip)封装保密的一种单组份热固化环氧树脂胶粘剂，俗名：黑胶或COB（Chip-On-Board）邦定胶，常用的主要为两种类型，一是邦定热胶，一是邦定冷胶。。

   很多人在使用邦定胶前，都不太清楚，邦定热胶是什么胶，邦定冷胶又是什么胶，是不是邦定热胶就是需要加热固化的，而邦定冷胶就是可以自然固化不需要加热。其实不是，不管是邦定冷胶还是邦定热胶，其主要类别是单组份热固化环氧树脂密封胶，所以，它们的固化过程都是需要放于烤箱中进行加热才可以固化成型；那么，为什么会有冷热之分呢？其实，之所以这样叫，主要是其点胶时间待封装的线路板是否要先进行预热；

   邦定热胶在点胶封胶时需要对PCB板预热到一定的温度，冷胶在点胶封胶时不需预热电路板，室温下即可，但热胶在性能，固化外观方面要好于冷胶，可根据产品需要自行选择。还有通常所讲的亮光胶和哑光胶的区别在于固化后的外观是亮光还是哑光，一般邦定热胶固化后是哑光的而邦定冷胶固化后是亮光的。还有有时会说到高胶和低胶，它们的区别在于包封时胶的堆积高度，一般厂商可依据要求进行调整胶水的浓度来实现堆积的高度。华创材料-专业胶粘剂研发生产企业，始于1999年！

   那么，该如何选用呢？通常，邦定热胶的价格比邦定冷胶要贵很多，邦定热胶在固化后的粘接强度、密封性、耐热性、抗冲击性等等都要优于邦定冷胶，简单来讲就是邦定热胶固化后的各项性能都要比邦定冷胶高出很多，还有就是邦定热胶一般不含溶剂，气味较低，环保性更高，而邦定冷胶在使用过程中往往要添加一定比例的溶剂才能使用。所以，这个需根据自已产品的实际情况进行选用

Cob bonding adhesive / IC packaging adhesive refers to a kind of one component heat curing epoxy resin adhesive which is used for the packaging of exposed integrated circuit chip (IC chip). The common name is black glue or cob (chip on board) bonding adhesive. There are two types of commonly used adhesives, one is bonding hot glue, the other is bonding cold glue..

Many people don't know what kind of bonding hot glue is and what kind of bonding cold glue is before using Bondin glue. Whether bondinghot glue needs to be cured by heating, while bondingcold glue can be naturally cured without heating. In fact, it is not. Whether it is bondingcold adhesive or bondinghot adhesive, its main category is one-component heat curing epoxy resin sealant, www.xkask.com Their curing process needs to be placed in the oven for heating before they can be solidified; so, why is there a difference between hot and cold? In fact, the reason why it is so called is mainly whether the circuit board to be packaged should be preheated first;